We are seeking a Senior Equipment Engineer to develop next-generation laser alignment, optical attachment, and packaging equipment for photonics applications.
Responsibilities
- Design and develop precision equipment, mechanisms, fixtures, and subsystems for laser alignment, optical attachment, photonic packaging, testing, and automation applications.
- Translate system and process requirements into robust equipment solutions with consideration for precision, reliability, manufacturability, and cost.
- Design precision positioning, alignment, motion control, and opto-mechanical systems to achieve high-performance assembly and packaging processes.
- Perform tolerance analysis, GD&T, and precision alignment studies to ensure system accuracy and repeatability.
- Develop 3D models, engineering drawings, BOMs, and technical documentation using SolidWorks.
- Lead prototype builds, system integration, debugging, verification, and performance optimization.
- Collaborate with optical, electrical, software, process, manufacturing, and quality teams to deliver complete equipment solutions.
- Support supplier engagement, NPI activities, equipment qualification, and manufacturing deployment.
Required
- Master's degree or above in Mechanical Engineering, Mechatronics, Opto-Mechanical Engineering, Automation, or related disciplines.
- Strong experience in precision mechanical and opto-mechanical system design.
- Hands-on experience developing semiconductor equipment, automation systems, assembly equipment, inspection systems, or other complex electro-mechanical systems.
- Solid understanding of precision alignment, tolerance analysis, GD&T, materials, and manufacturing processes.
- Proficiency in SolidWorks and engineering documentation.
- Experience in system integration, troubleshooting, root cause analysis, and engineering validation.
- Strong problem-solving skills and ability to work independently in a fast-paced environment.
- Excellent communication and teamwork skills.
Preferred
Experience in one or more of the following areas:
- Active Optical Alignment
- Laser Attach / Die Attach
- Optical Module Assembly
- Silicon Photonics (SiPh)
- Photonic Packaging
- Precision Motion Control & Nanopositioning
- Machine Vision & Optical Metrology
- Semiconductor Assembly Equipment
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