What We’re Looking For:
We’re looking for engineers to contribute to the thermomechanical, electrical and mechanical design and assembly of the IO modules that attach to our A-0 and A-1 wafers.
Ideal Background:
- Deep understanding and hands-on experience with signal integrity signoff for copper and electro-optic connector interfaces
- Hands-on experience with mechanical aspects of electrical and electro-optic connectors
- Experience with bringup of connectorized links and systems
Nice to Have:
- Experience and understanding of sockets and socketed connectors
- Experience with co-packaged copper and co-packaged optics
- Experience with high density optical modules
- Experience with XPO optical pluggable form factors