What We're Looking For:
We're looking for technical program managers to own programs across our wafer-scale photonic systems. Each TPM owns one program and works embedded with the engineering team that carries most of it, from packaging and assembly to silicon and system bring-up. We have two openings.
This is a hands-on role. You'll own the schedule, the risks and the handoffs between teams, and you'll work in the technical details alongside the engineers. We want someone who gets things done themselves, not someone who only tracks status.
Ideal Background:
- 8+ years in semiconductor or hardware development, as an engineer, a program manager or both, with programs taken from development to working hardware
- Deep working knowledge of at least one of: advanced packaging and assembly, or ASIC/SoC and system hardware
- Communicates clearly and directly with engineers, partners and leadership
- Reads specifications closely and spots gaps, conflicts and missing owners
- Action-oriented: builds plans and schedules that engineers actually use, and drives them to done
- Experience running work with external partners (foundries, OSATs, IP or design-services vendors)
Nice to Have:
- Advanced packaging (2.5D/3D, chiplet, flip chip), including complex multi-die packages
- Experience with chip-on-wafer (CoW) assembly, including mechanical stress and thermal effects
- Photonic, optoelectronic or other heterogeneous-material assemblies
- Reliability qualification, failure analysis, test vehicles and DOEs
- Advanced-node ASIC/SoC tape-outs and work with third-party IP or design-services partners
- Multi-die, chiplet or MCM programs, including chip-package co-design
- System hardware (boards, power, thermal, mechanical) through bring-up
- Optical I/O or high-speed SerDes programs
- Data-center or OCP-style hardware
- Experience with Jira and Confluence