Log inSign up free
  • Home
  • Jobs
    • Applications
    • Career
    • Resume
    • Cover letters
  • Content
    • Posts
    • Media
  • Messages
  • Analytics
    • Overview
    • Pages
  • Builder
    • Templates
  • More tools
    • Profile
    • Hiring
  • Settings
All jobs
INIntel logo

Intel

MYS - Penang, Malaysia

Product Development Engineer.

ENGINEERING
Job Details: Job Description: Drives and develops testability and manufacturability of integrated circuits from the component feasibility stage through production ramp. Contributes to design, development, and validation of testability circuits, test flows, and methodologies for new products through evaluation, development, and debug of complex test methods. Interfaces with process development, fab, factory, assembly, quality and reliability, and manufacturing groups to enable postsilicon HVM ramp. Evaluates new designs on automatic test equipment (ATE) and works with the design, DFx, and product development teams to debug functionality and performance issues to root cause. Performs ATE device characterization, utilizes that data to define datasheet specifications and performs yield analysis. Collaborates with designers to drive design for test/debug/manufacturing (DFT/DFD/DFM) features enabling efficient production testing of new products. Develops and debugs complex software programs to convert design validation vectors and drive complex test equipment. Creates and tests validation and production test hardware solutions. Tests, validates, modifies, and redesigns circuits to guarantee component margin to specification. Analyzes and evaluates component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability. Ensures manufacturability over process and product design through thorough analysis of process and spec corners and works with design to resolve yield issues before manufacturing ramp. Drives test time reduction through analysis of fallout data versus test time for various IPs to balance and drive overall product cost optimizations. Analyzes early customer returns with emphasis on driving test hole closure activities. Creates and applies concepts for optimizing component production relative to both quality and cost constraints. Leads and drives manufacturing readiness from fab, assembly, and test factory to support engineering sample and customer sample generation (ES milestones), wafer start planning, product qual execution strategy and capacity analysis, and assembly and test site certification activities. Works with fab, assembly, and test factory partners and planners to support production ramp. May also manage execution of new product introductions in the fab, fab process targeting, product/process optimizations, and participate in factory task forces to bring product perspective and respond to product issues. Optimizes product supply through data analysis of postsilicon binsplit, die level cherry pick (DLCP), and optimize sort/test content and yield downstream through data analysis. Qualifications: Minimum Qualifications Bachelor’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field with 0-1 years of hands-on experience in the domain, showcasing skills gained through internships, academic projects, coursework, or hands-on training. OR a Master’s degree in a relevant field with no prior professional experience. Proficiency in programming languages such as Python, C++, or PERL. Basic knowledge of data analysis tools like JMP, Power BI, SQL, and Excel. Understanding of electronics components and circuit analysis. Preferred Qualifications Experience with automated test equipment (ATE) and test program development. Strong problem-solving and prioritization skills with an independent and inquisitive mindset. Excellent verbal and written communication skills. A willingness to learn and passion for innovation in manufacturing engineering. Familiarity with machine learning pipelines or yield improvement practices is a plus. Be part of a dynamic and collaborative team working at the forefront of technology. Apply your skills to solve complex challenges and help shape the future of Intel’s products. Job Type: Experienced Hire Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website. Find your next job and take on projects that shape tomorrow’s technology. Benefits Internships Life at Intel Locations Recruitment Process
Pay
Not stated
Where
MYS - Penang, Malaysia
Work
Not stated
Type
Not stated
Posted
5 Nov, 2026
Apply on the original postingSign in to apply

Verified board

more at Intel.

6 Nov, 2026

Intel

Test Module Engineer

INIntel logo
  • Engineering

Malaysia, Kulim

Salary not listed

Details
6 Nov, 2026

Intel

Industrial AI Solution Arch

INIntel logo
  • Data & ML

PRC, Shanghai

Salary not listed

Details
2 Nov, 2026

Intel

CPU Validation Engineer

INIntel logo
  • Engineering

MYS - Penang, Malaysia

Salary not listed

Details

similar roles.

6 Nov, 2026

General Dynamics Missions System International

System Integration Verification & Validation

GDGeneral Dynamics Missions System International logo
  • Full time
  • On-site
  • Engineering

$77k–90k/yr

Ottawa, ca

Details
6 Nov, 2026

General Dynamics Missions System International

Senior Human Factors Engineering Analyst

GDGeneral Dynamics Missions System International logo
  • Full time
  • Senior level
  • Engineering

$110.5k–138k/yr

Ottawa, ca

Details
6 Nov, 2026

OceanaGold

Mining Engineer (Open Pit)

OCOceanaGold logo
  • Full time
  • Engineering

Macraes, nz

Full time

Details
6 Nov, 2026

OceanaGold

Principal Mining Engineer

OCOceanaGold logo
  • Full time
  • Staff level
  • Engineering

Kasibu, ph

Full time

Details
3 Nov, 2026

Quantum Industrial Services

Mechanical BIM Modeler (Plumbing & Piping)

QIQuantum Industrial Services logo
  • Full time
  • Engineering

Marriott Slaterville, UT

Full time

Details
6 Nov, 2026

Tomra

Field Service Engineer - Recycling - Australia*

TOTomra logo
  • Full time
  • Remote
  • Engineering

Sydney, au

Remote

Details