1) Main Responsibilities
- Provide technical support for customer development programs (Mobile AiP, SiP, FC-CSP, RF).
- Resolve technical issues and drive performance stabilization at the customer.
- Identify and develop PoC opportunities through customerengagement.
- Guide BOM and substrate structure selection using LGIT technicalsolutions.
- Lead design reviews, TRA assessments, yield improvement, and production readiness.
- Coordinate between customer engineering and LGIT R&D, Process,Quality, and Manufacturing.
2) Others
- Conduct regular customer meetings and technical presentations.
- Collect customer VOC and market intelligence to shape technology roadmaps.
- Support technology promotions, exhibitions, and strategic customer engagements.
- Promote advanced substrate technologies (Hybrid Stack-up, Fine Pattern, Cavity, Hyper Flex).
Requirements
- Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or a related field.
- Bilingual in both English and Korean
- - 10+ years in package substrate development, process or customer engineering, or technical marketing.
- Proven record of leading substrate projects through mass production.
- Experience supporting major semiconductor customers preferred.
- Deep knowledge of substrate processes, materials, structures, and design rules.
- Hands-on experience with ABF, ETS, Hybrid Stack-up, Cavity, Fine Pattern, and RF.
- Ability to translate customer requirements into technical solutions.
- Experience in NPI, yield improvement, and production transfer.
- Strong customer relationship management skills.
- Clear technical presentation and communication skills.
- Project management and problem-solving capability.
- MS Office (PowerPoint, Excel, Word).
- Six Sigma Green Belt or equivalent preferred.
- PMP or equivalent project management certification preferred.
Travel:
- On-site customer support with frequent customer engagement.
- Frequent travel to customer sites within the U.S.
- Periodic travel to Korea for engineering and business reviews.