The 3D NAND Process Integration Engineer is responsible for defining, integrating, and qualifying advanced 3D NAND process technologies from early pathfinding through technology development and manufacturing qualification. This role requires deep expertise in 3D NAND architecture, process integration, and advanced patterning/etch technologies, with particular emphasis on staircase formation, multilayer stack engineering, and high-aspect-ratio process optimization. The successful candidate will drive the integration of critical 3D NAND process modules, identify technology gaps, and develop innovative solutions to achieve aggressive density, performance, reliability, yield, and cost targets.
Defines roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines.
- BS, MS, or PhD in Electrical Engineering, Microelectronics, Physics, Chemical Engineering, Materials Science, or a related field.
- Strong industry experience in 3D NAND process integration, process development, or device engineering.
- Deep understanding of:
- 3D NAND cell architecture
- Staircase architecture and contact integration
- HARC formation and high-aspect-ratio etch/fill processes
- Semiconductor process integration and scaling challenges
- Statistical analysis, DOE methodologies, and data-driven optimization
- Demonstrated ability to solve complex integration problems involving multiple process modules and competing technical tradeoffs.
- Strong communication and leadership skills with the ability to influence cross-functional technical teams in a fast-paced R&D environment.
This position is also eligible to participate in Solidigm's restricted stock unit (RSU), restricted cash unit (RCU), and cash bonus programs. In addition, Solidigm offers a benefits package that includes medical, dental, vision, supplemental life and AD&D insurance; short- and long-term disability; healthcare and dependent care flexible spending accounts, and a company match on eligible 401(k) plan contributions.
The compensation range for this role is $121,280 - $194,100. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.
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