Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are passionate about sustainability, and are committed to providing leading-edge products and innovation to our customers. Our portfolio of technology helps power our world ---come join our team and see how YOU can make a difference. Job Description: Develop new package type and package structure Responsibilities: Survey new material to meet new package processes, reliability, and cost requirements Collect packaging information/requirement from TME/DE/Marketing/Competitor for next generation package development Sum up the experience of package design & process, and maintain package design rules & update package road map Perform other tasks assigned by supervisor Qualifications: Package or Power Electronics Major Doctor’s degree Good knowledge of package development principles Knowledge of semiconductor supply chain, familiar with assembly sub-contractors, and packaging material vendors Fluent in spoken and written English Familiar with AutoCAD or Cadence software is a plus Monolithic Power Systems, Inc. (MPS) is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of MPS to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status or special disabled veteran, marital status, pregnancy, genetic information, or any other legally protected status. Welcome to Monolithic Power Systems, Inc. Careers! Can’t find a suitable opening? Join our talent community using the "Get Started" link below! Monolithic Power Systems, Inc. (NASDAQ: MPWR) provides small, highly energy efficient, easy-to-use power solutions for systems found in industrial applications, telecom infrastructures, cloud computing, automotive, and consumer applications.

Package R&D Engineer (New Grad).

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