About SK hynix America:
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
Job Overview:
SK hynix America is seeking a highly experienced and motivated ADK (Assembly Design Kit) engineer to join our Advanced Packaging R&D team. In this critical role, you will be at the forefront of semiconductor innovation, leading the development of robust design rules and verification flows for our next-generation 2.5D/3D Interposer and Heterogeneous Integration technologies.
You will serve as the vital bridge between package architecture, process integration, and design implementation. Your primary responsibility will be defining the Design Rules, DRC (Design Rule Check), and LVS (Layout vs. Schematic) frameworks that ensure our advanced designs are manufactural, reliable, and high-yielding. The ideal candidate possesses deep expertise in Physical Verification (PV), a comprehensive understanding of semiconductor packaging processes (specifically TSV, Micro-bump, bridge die and RDL), and the strategic ability to translate complex process constraints into design rules. Furthermore, you will play a key role in optimizing the overall design-to-signoff flow, ensuring seamless integration across multidisciplinary teams.
Responsibilities:
- ADK Development & Maintenance: Lead the creation and maintenance of comprehensive Assembly Design Kits (ADK) tailored for advanced packaging technologies (2.5D/3D IC, SiP, Fan-Out).
- Rule Definition & Verification: Define, debug, and validate Design Rules (DRC) and Layout vs. Schematic (LVS) checks, accounting for package-specific constraints such as bump placement, RDL routing, TSV integration, and wire bonding.
- Cross-Functional Collaboration: Partner closely with package design, process integration, and manufacturing teams to ensure design rule accuracy, maximize yield, and accelerate time-to-market.
- Physical Verification Support: Provide expert support to design teams in resolving complex physical verification issues arising from die-to-package integration and heterogeneous stacking.
- Flow Automation & Optimization: Develop and automate verification flows using advanced scripting, integrating tools from Synopsys, Cadence, and Siemens EDA to enhance efficiency and data integrity.
- Design Flow Strategy: Analyze and optimize the end-to-end package design flow, identifying bottlenecks and implementing best practices to streamline the journey from concept to GDSII sign-off.
Qualifications:
- Education: B.S. or M.S. in Electrical Engineering, Computer Engineering, or a related field.
- Experience: Minimum 3+ years of hands-on experience in Physical Design, CAD, or PDK/ADK development within the semiconductor or packaging industry.
- Tool Proficiency: Extensive experience with industry-standard sign-off tools from multiple vendors such as Synopsys (IC Validator, 3DICC), Cadence (PVS, Virtuoso, Integrity 3D-IC), Siemens EDA (Calibre)
- Technical Skills: Deep knowledge of design rule structures, verification methodologies, and GDSII/OASIS data formats.
Preferred Qualifications:
- Design Flow Expertise: Proven track record in managing physical design flows from concept to GDSII/OASIS sign-off. Ability to translate process constraints into design rules, whether in advanced packaging or front-end logic/foundry technologies.
- Scripting skills: Proficiency in Tcl, Perl, Python, or SKILL for flow automation is highly preferred.
- Manufacturing Insight: Knowledge of semiconductor manufacturing processes (Reflow, Molding, Bonding or Front-end FEOL/BEOL processes) and their impact on residual stress and design rule margins.
- Excellent communication skills to collaborate effectively within a multidisciplinary, global R&D environment.
Benefits:
- Top Tier health insurance at no employee cost
- Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
- 401k Matching
- Flexible Spending Account (FSA) for Health Care & Dependent Care
- Educational reimbursement up to $10,000 per year
- Donation Matching and volunteering opportunities
- Corporate discount programs
- Free Breakfast/Lunch/Dinner provided to employees
Compensation:
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.
Equal Employment Opportunity:
SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.
In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying: