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ECensurge.com logo

ensurge.com

San Jose, California

Senior Manufacturing Engineer – Thin Film Engineering (PVD, PECVD, ALD & RIE).

FULL TIMESENIOR LEVELENGINEERING$162K–198K/YR

About Ensurge Micropower


Ensurge Micropower (OSE: ENSU) is a pioneer in solid-state microbattery technology,
enabling the next generation of intelligent, connected devices. Leveraging proprietary thin-film and roll-to-roll manufacturing, Ensurge delivers safe, high-energy-density batteries for
wearables, health tech, industrial sensing, and defense applications. As our technology
transitions from development to production, disciplined manufacturing execution becomes the
differentiator.


Role Overview
Ensurge is seeking a Senior Manufacturing Engineer (IC) to own and scale the Thin-Film
Engineering processes — deposition (PVD/Sputtering, PECVD, ALD) and etch (RIE) — from
pilot through early production. This role is not just about process — it is about delivering
manufacturing results.


Responsibilities



Own daily manufacturing performance for the PVD/Sputtering, PECVD, ALD, and RIE
process areas

  • Drive output, yield, uptime, and cycle time
  • Support production directly — troubleshooting issues in real time
  • Partner with Operations to ensure line execution meets plan


Convert R&D processes into repeatable, production-ready workflows

  • Define and lock critical process parameters (CPPs) — e.g., chamber pressure, Ar/process
    gas flow, RF/DC power, substrate bias, deposition rate, film stress and thickness
    uniformity targets (PVD/PECVD); precursor/co-reactant pulse and purge times, cycle
    count, growth per cycle (GPC), and substrate temperature (ALD); RF power, gas
    chemistry (e.g., CF4/O2/Cl2), etch rate, selectivity, sidewall profile/anisotropy, DC bias,
    and endpoint detection (RIE)
  • Define and lock control limits and OCAPs
  • Ensure processes are robust, stable, and scalable

    Work with Equipment Engineering to:
  • Define tool requirements (sputter cathodes/targets, PECVD chambers, ALD reactors and
    precursor delivery systems, RIE/ICP-RIE chambers and endpoint detection systems,
    RF/DC power supplies, vacuum, gas delivery, and abatement/scrubber systems)
  • Improve reliability and uptime
  • Implement process-driven upgrades
  • Lead tool qualification and process acceptance
  • Ensure equipment supports throughput, precision, and repeatability



    Own flow from substrate input → deposition/etch → downstream handoff to assembly
  • Reduce bottlenecks, WIP, and inefficiencies
  • Improve line balance and production scheduling alignment
  • Support layout and flow improvements as the system scales

    Partner with Quality to implement:
  • SPC and process control on film thickness, stress, uniformity, and conformality
  • Film characterization (ellipsometry, profilometry, XRD, SEM/AFM, four-point probe) to validate deposition results against CPPs
  • Traceability and data capture

    Build and maintain:
  • SOPs
  • Process specs
  • Control plans
  • Ensure manufacturing is data-driven and auditable   

    Lead structured RCA on:
  • Yield loss
  • Defects
  • Downtime
  • Use characterization data (SEM, XRD, cross-section imaging) to root-cause excursions
  • Implement sustainable fixes — not workarounds
  • Drive continuous improvement aligned to operational excellence principles (standard work, DMS, etc.)

    Qualifications

    Required

  • 7–12+ years in manufacturing engineering with thin-film deposition and etch
    (PVD/sputtering, PECVD, ALD, and/or RIE) in battery, semiconductor, or thin-film
    industries
  • Proven experience owning manufacturing processes on the floor
  • Strong track record of driving yield and throughput improvements
  • Experience supporting or leading pilot → production scale-up
  • Hands-on mindset — comfortable working directly with equipment, technicians, and
    operators
  • Working knowledge of thin-film characterization techniques (e.g., ellipsometry,
    profilometry, XRD, SEM) and their use in validating and controlling deposition processes

    Preferred

  • Understanding of film stress engineering, plasma physics, RF coupling, and DC self-bias
  • Understanding of plasma etch chemistry, selectivity, anisotropy, and endpoint detection
    (RIE/ICP-RIE)
  • Familiarity with ALD precursor chemistry, self-limiting surface reactions, and pulse/purge sequencing
  • Vacuum systems and chamber conditioning experience
  • Experience with image-based film/defect characterization (SEM, optical microscopy) and
    correlating characterization data back to process control limits
  • Experience with MES, traceability systems, or data-driven manufacturing

    Salary Range:
    $162,000-$198,000
    The base salary range is specific to California. The salary of the final candidate selected for this role will be determined by a variety of factors, including, but not limited to, internal equity, experience, education, specialty, and training.
Pay
$162k–198k/yr
Where
San Jose, California
Work
Not stated
Type
Full time
Posted
22 Jul, 2026
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