Mobileye develops purpose-built hardware and AI technologies that power advanced driver-assistance and autonomous-driving solutions. Our EyeQ™ SoCs and imaging radar technologies are designed to deliver scalable, automotive-grade performance and help enable safer mobility worldwide.
Join our advanced packaging team and take ownership of package-substrate layout for cutting-edge digital and RF products. You will collaborate with silicon, package, SI/PI, PCB, manufacturing, and OSAT teams to deliver high-quality, manufacturable package layouts that meet demanding automotive requirementsWhat will your job look like:
- Own IC package-substrate layout from feasibility through manufacturing release.
- Perform die placement, bump fan-out, ball-map planning, package-size estimation, and layer planning.
- Set up stack-ups, padstacks, design rules, and layout constraints.
- Implement high-density bump-to-ball routing for signal, power, and ground nets.
- Route high-speed and RF interfaces according to defined SI/PI constraints.
- Perform DRC, connectivity, LVS/netlist, and DFM checks.
- Generate artwork, fabrication drawings, reports, and release documentation.
- Resolve layout-related queries from substrate manufacturers and OSATs.
All you need is:
- B.Sc. in Electrical Engineering or a related field, or equivalent practical experience.
- 5+ years of hands-on IC package-substrate layout experience.
- Strong proficiency with Cadence Allegro Package Designer.
- Experience with flip-chip BGA, bump fan-out, ball-map optimization, and multilayer substrate routing.
- Experience working from schematics, netlists, design rules, and constraint documents.
- Good understanding of high-speed layout principles, including differential pairs, length matching, spacing, and return paths.
- Good understanding of power-delivery and power-integrity layout principles, including power and ground plane design, current-carrying requirements, and via-array implementation.
- Experience with DRC, connectivity verification, DFM, and manufacturing-data release.
- Strong attention to detail and the ability to independently own designs through release.
Nice to have:
- Experience with RF, SiP, multi-die, interposer, or 2.5D package layouts.
- Experience with DDR, PCIe, SerDes, MIPI, or UFS interfaces.
- Experience with Siemens Xpedition Package Designer or CAM350.
- Experience working directly with substrate manufacturers and OSATs.
- Experience with scripting for package-layout automation.
Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!